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INTEGRATED CIRCUITS
DATA SHEET
TDA8547TS 2 x 0.7 W BTL audio amplifier with output channel switching
Product specification Supersedes data of 1997 Oct 14 File under Integrated Circuits, IC01 1998 Apr 01
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
FEATURES * Selection between output channels * Flexibility in use * Few external components * Low saturation voltage of output stage * Gain can be fixed with external resistors * Standby mode controlled by CMOS compatible levels * Low standby current * No switch-on/switch-off plops * High supply voltage ripple rejection * Protected against electrostatic discharge * Outputs short-circuit safe to ground, VCC and across the load * Thermally protected. APPLICATIONS * Telecommunication equipment * Portable consumer products * Personal computers * Motor-driver (servo). QUICK REFERENCE DATA SYMBOL VCC Iq Istb Po PARAMETER supply voltage quiescent current standby current output power two channels one channel THD SVRR total harmonic distortion supply voltage ripple rejection THD = 10%; RL = 8 ; VCC = 3.3 V THD = 10%; RL = 16 ; VCC = 5 V THD = 10%; RL = 8 ; VCC = 5 V THD = 10%; RL = 4 ; VCC = 3.3 V Po = 0.4 W 0.5 0.6 1 1 - 50 0.6 0.7 1.2 1.2 VCC = 5 V; 2 channels VCC = 5 V; 1 channel CONDITIONS MIN. 2.2 - - - GENERAL DESCRIPTION
TDA8547TS
The TDA8547TS is a two channel audio power amplifier for an output power of 2 x 0.7 W with a 16 load at a 5 V supply. At a low supply voltage of 3.3 V an output power of 0.6 W with an 8 load can be obtained. The circuit contains two BTL amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The operating condition of all channels of the device (standby, mute or on) is externally controlled by the MODE pin. With the SELECT pin one of the output channels can be switched in the standby condition. This feature can be used for loudspeaker selection and also reduces the quiescent current consumption. When only one channel is used the maximum output power is 1.2 W.
TYP. 5 15 8 -
MAX. 18 22 12 10 - - - - - -
UNIT V mA mA A W W W W % dB
0.15 -
ORDERING INFORMATION TYPE NUMBER TDA8547TS PACKAGE NAME DESCRIPTION VERSION SOT266-1
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
1998 Apr 01
2
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
BLOCK DIAGRAM
TDA8547TS
handbook, full pagewidth
VCC1 VCC2 20 11
-
IN1- IN1+ 17 16
- +
R VCC1 R
18
OUT1-
20 k
- - +
3
OUT1+
20 k
STANDBY/MUTE LOGIC
-
IN2- IN2+ 14 15
TDA8547TS
13 OUT2-
- +
R VCC2 R
20 k 5 20 k 4 6 5 2, 7, 9, 12, 19
- - +
8
OUT2+
SVRR
MODE SELECT n.c.
STANDBY/MUTE LOGIC
1
10
MGK984
GND1 GND2
Fig.1 Block diagram.
1998 Apr 01
3
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
PINNING SYMBOL PIN GND1 n.c. OUT1+ MODE SVRR SELECT n.c. OUT2+ n.c. GND2 VCC2 n.c. OUT2- IN2- IN2+ IN1+ IN1- OUT1- n.c. VCC1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION ground, channel 1 not connected positive loudspeaker terminal, channel 1 operating mode select (standby, mute, operating) half supply voltage, decoupling ripple rejection input for selection of operating channel not connected positive loudspeaker terminal, channel 2 not connected ground, channel 2 supply voltage, channel 2 not connected negative loudspeaker terminal, channel 2 negative input, channel 2 positive input, channel 2 positive input, channel 1 negative input, channel 1 negative loudspeaker terminal, channel 1 not connected supply voltage, channel 1
SVRR 5
handbook, halfpage
TDA8547TS
GND1 1 n.c. 2 OUT1+ 3 MODE 4
20 VCC1 19 n.c. 18 OUT1- 17 IN1- 16 IN1+
TDA8547TS
SELECT 6 n.c. 7 OUT2+ 8 n.c. 9 GND2 10
MGK998
15 IN2+ 14 IN2- 13 OUT2- 12 n.c. 11 VCC2
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION The TDA8547TS is a 2 x 0.7 W BTL audio power amplifier capable of delivering 2 x 0.7 W output power to a 16 load at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range from 6 to 30 dB by external feedback resistors. Power amplifier The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of a NPN power 1998 Apr 01 4
transistor. The total voltage loss is <1 V and with a 5 V supply voltage and a 16 loudspeaker an output power of 0.7 W can be delivered, when two channels are operating. If only one channel is operating then an output power of 1.2 W can be delivered (5 V, 8 ). MODE pin The whole device (both channels) is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is >(VCC - 0.5 V), or if this pin is floating. At a MODE voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1.5 V and VCC - 1.5 V the amplifier is in mute condition. The mute condition is useful to suppress plop noise at the output caused by charging of the input capacitor.
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
SELECT pin If the voltage at the SELECT pin is in the range between 1.5 V and VCC - 1.5 V, or if it is kept floating, then both channels can be operational. If the SELECT pin is set to a LOW voltage or grounded, then only channel 2 can operate and the power amplifier of channel 1 will be in the standby mode. In this case only the loudspeaker at channel 2 can operate and the loudspeaker at channel 1 will be switched off. If the SELECT pin is set to a HIGH level or connected to VCC, then only channel 1 can operate and the power amplifier of channel 2 will be in the standby mode. In this case only the loudspeaker at channel 1 can operate and the loudspeaker at channel 2 will be switched off. Setting the SELECT pin to a LOW or
TDA8547TS
a HIGH voltage results in a reduction of quiescent current consumption by a factor of approximately 2. Switching with the SELECT pin during operating is not plop-free, because the input capacitor of the channel which is coming out of standby needs to be charged first. For plop-free channel selecting the device has first to be set in mute condition with the MODE pin (between 1.5 V and VCC - 1.5 V), then set the SELECT pin to the new level, after a delay set the MODE pin to a LOW level. The delay needed depends on the values of the input capacitor and the feedback resistors. Time needed is approx. 10 x C1 x (R1 + R2), so approximately 0.6 s. for the values in Fig.4.
Table 1 Control pins MODE and SELECT versus status of output channels Voltage levels at control pins at VP = 5 V; for other supply voltages see Figs. 14 and 15. CONTROL PIN MODE HIGH(1)/NC(2) HVP(4) LOW(5) HVP(4)/LOW(5) HVP(4)/LOW(5) HVP(4)/LOW(5) Notes 1. HIGH = Vpin > VCC - 0.5 V. 2. NC = not connected or floating. 3. X = don't care. 4. HVP = 1.5 V < Vpin < VCC - 1.5 V. 5. LOW = Vpin < 0.5 V. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VI IORM Tstg Tamb VPsc Ptot PARAMETER supply voltage input voltage repetitive peak output current storage temperature operating ambient temperature AC and DC short-circuit safe voltage power dissipation CONDITIONS operating MIN. -0.3 -0.3 - -55 -40 - - MAX. +18 VCC + 0.3 1 +150 +85 10 1.1 V V A C C V W UNIT SELECT X(3) HVP(4)/NC(2) HVP(4)/NC(2) HIGH(1) HVP(4)/NC(2) LOW(5) STATUS OF OUTPUT CHANNEL CHANNEL 1 CHANNEL 2 standby mute on mute/on mute/on standby standby mute on standby mute/on mute/on 0 15 15 8 15 8 TYP. Iq (mA)
1998 Apr 01
5
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
QUALITY SPECIFICATION In accordance with "SNW-FQ-611-E". THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 110
TDA8547TS
UNIT K/W
handbook, halfpage
2.0
MGK987
P (W)
1.6
1.2
0.8
0.4
0 0 40 80 120 160 Tamb (C)
Fig.3 Power derating curve.
Table 2
Maximum ambient temperature at different conditions CONTINUOUS SINE WAVE DRIVEN RL () 4 4 8 8 8 8 16 16 Po (W)(1) 1.2 2 x 1.2 0.6 2 x 0.6 1.2 2 x 1.2 0.7 2 x 0.7
VCC (V) 3.3 3.3 3.3 3.3 5 5 5 5 Note 1. At THD = 10%.
APPLICATION 1 channel 2 channels 1 channels 2 channels 1 channel 2 channels 1 channel 2 channels
Pmax (W) 0.58 1.12 0.3 0.60 0.67 1.33 0.35 0.70
Tamb(max) (C) 86 27 117 84 76 - 112 73
1998 Apr 01
6
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
DC CHARACTERISTICS VCC = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless otherwise specified. SYMBOL VCC Iq PARAMETER supply voltage quiescent current CONDITIONS operating BTL 2 channels; note 1 BTL 1 channel; note 1 Istb VO standby current DC output voltage VMODE = VCC note 2 - - - - - - operating mute standby IMODE VSELECT input current MODE pin input voltage SELECT pin 0 V < VMODE < VCC 0 1.5 - MIN. 2.2 5 15 8 - 2.2 - - - - - - - - TYP. MAX. 18 22 12 10 - 50 500 0.5 VCC 20 1 VCC 100 V mA mA A V mV nA V V A V V A UNIT
VOUT+ - VOUT- differential output voltage offset IIN+, IIN- VMODE input bias current input voltage MODE pin
VCC - 1.5 V
VCC - 0.5 -
channel 1 = standby; 0 channel 2 = on channel 1 = on; channel 2 = standby VCC - 1 -
ISELECT Notes
input current SELECT pin
VSELECT = 0 V
1. Measured with RL = . With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. 2. The DC output voltage with respect to ground is approximately 0.5VCC.
1998 Apr 01
7
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
AC CHARACTERISTICS VCC = 5 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless otherwise specified. SYMBOL Po THD Gv Zi Vno SVRR Vo cs Notes R2 1. Gain of the amplifier is 2 x ------- in BTL application circuit Fig.4. R1 2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of RS = 0 at the input. 3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. 5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz, so including noise. 6. Channel separation is measured at the output with a source impedance of RS = 0 at the input and a frequency of 1 kHz. The output power in the operating channel is set to 0.5 W. PARAMETER output power, one channel total harmonic distortion closed loop voltage gain differential input impedance noise output voltage supply voltage ripple rejection output voltage channel separation note 2 note 3 note 4 note 5 CONDITIONS THD = 10% THD = 0.5% Po = 0.4 W note 1 MIN. 1 0.6 - 6 - - 50 40 - TYP. 1.2 0.9 0.15 - 100 - - - - - MAX. - - 0.3 30 - 100 - - 200 - UNIT W W % dB k V dB dB V dB
VSELECT = 0.5VCC; note 6 40
1998 Apr 01
8
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TEST AND APPLICATION INFORMATION Test conditions Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The thermal resistance = 110 K/W for the SSOP20; the maximum sine wave power dissipation for Tamb = 25 C 150 - 25 is: --------------------- = 1.14 W 110 For Tamb = 60 C the maximum total power dissipation is: 150 - 60 --------------------- = 0.82 W 110 Thermal Design Considerations The `measured' thermal resistance of the IC package is highly dependent on the configuration and size of the application board. Data may not be comparable between different Semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area!) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating. The SSOP package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.24) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to about 80 K/W. For Tamb = 60 C the maximum total power dissipation at 150 - 60 this PCB layout is: --------------------- = 1.12 W 80 Please note that this two channel IC is mentioned for application with only one channel active. For that reason the curves for worst case power dissipation are given for the condition of only one of the both channels driven with a 1 kHz sine wave signal. BTL application Tamb = 25 C if not specially mentioned, VCC = 5 V, f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The BTL application circuit is illustrated in Fig.4. SE application
TDA8547TS
The quiescent current has been measured without any load impedance and both channels driven. When one channel is active the quiescent current will be halved. The total harmonic distortion as a function of frequency was measured using a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies: increasing the value of C3 increases the performance of the SVRR. The figure of the MODE voltage (VMODE) as a function of the supply voltage shows three areas; operating, mute and standby. It shows, that the DC-switching levels of the mute and standby respectively depend on the supply voltage level. The figure of the SELECT voltage (VSELECT) as a function of the supply voltage shows the voltage levels for switching the channels in the active, mute or standby mode.
Tamb = 25 C if not specially mentioned, VCC = 7.5 V, f = 1 kHz, RL = 4 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The SE application circuit is illustrated in Fig.16. Increasing the value of electrolytic capacitor C3 will result in a better channel separation. Because the positive output is not designed for high output current (2 x Io) at low load impedance (16 ), the SE application with output capacitors connected to ground is advised. The capacitor value of C6/C7 in combination with the load impedance determines the low frequency behaviour. The THD as a function of frequency was measured using a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies: increasing the value of C3 increases the performance of the SVRR. General remark The frequency characteristic can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity to HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter.
1998 Apr 01
9
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
BTL APPLICATION
TDA8547TS
handbook, full pagewidth
C1 1 F
R2 R1 10 k
50 k IN1- IN1+ C3 47 F 17
20
11 18 OUT1-
C4 100 nF
VCC C5 100 F
Vi1
16 RL1 3 OUT1+
OUT2- C2 1 F R4 R3 10 k Vi2 50 k IN2- IN2+ SVRR MODE SELECT R2 Gain channel 1 = 2 x ------R1 R4 Gain channel 2 = 2 x ------R3 GND
MGK985
TDA8547TS
14 15 5 4 6 1 10 8 OUT2+ 13 OUT2- RL2
Fig.4 BTL application.
handbook, halfpage
30
MGD890
handbook, halfpage
10
MGK988
Iq (mA)
THD (%)
(1)
20
1
10
10-1
0 0 4 8 12 20 16 VCC (V)
10-2 10-2
10-1
1
Po (W)
10
RL = .
f = 1 kHz; Gv = 20 dB. (1) VCC = 5 V; RL = 8 .
Fig.5 Iq as a function of VCC.
Fig.6 THD as a function of Po.
1998 Apr 01
10
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, halfpage
10
MGK989
andbook, halfpage
-60
MGK699
THD (%) 1
(1)
cs (dB)
-70
(1)
(2)
-80
(3)
10-1 -90
10-2 10
102
103
104
f (Hz)
105
-100 10
102
103
104
f (Hz)
105
Po = 0.5 W; Gv = 20 dB. (1) VCC = 5 V; RL = 8 .
VCC = 5 V; Vo = 2 V; RL = 8 . (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
Fig.8 Fig.7 THD as a function of frequency.
Channel separation as a function of frequency.
handbook, halfpage
-20
MGD894
handbook, halfpage
2
MGK990
SVRR (dB) -40
(1)
Po (W) 1.5
(1) (2)
1
(2)
-60
(3)
0.5
-80 10
102
103
104
f (Hz)
105
0 0 4 8 VCC (V) 12
VCC = 5 V; RS = 0 ; Vr = 100 mV. (1) Gv = 30 dB. (2) Gv = 20 dB. (3) Gv = 6 dB.
THD = 10%. (1) RL = 8 . (2) RL = 16 .
Fig.9 SVRR as a function of frequency.
Fig.10 Po as a function of VCC.
1998 Apr 01
11
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, halfpage
1.5
MGK991
handbook, halfpage
1.5
MGK992
P (W) 1.0
(1) (2)
P (W)
1
(1)
0.5
0.5
0 0 4 8 VCC (V) 12
0 0 0.5 1 Po (W) 1.5
(1) RL = 8 . (2) RL = 16 .
Sine wave of 1 kHz. (1) VCC = 5 V; RL = 8 .
Fig.11 Worst case power dissipation as a function of VCC (one channel active).
Fig.12 Power dissipation as a function of Po (one channel active).
handbook, halfpage V
10 o (V) 1
MGL211
handbook, halfpage
16
MGL210
VMODE (V) 12 standby
10-1 10-2 10-3 10-4 10-5 10-6 10-1
(1) (2) (3)
8 mute 4
operating 1 10 VMODE (V) 102 0 0 4 8 12 VP (V) 16
Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V. (2) VCC = 5 V. (3) VCC = 12 V.
Fig.13 Vo as a function of VMODE.
Fig.14 VMODE as a function of VP.
1998 Apr 01
12
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, full pagewidth
20
MGK700
VSELECT (V) 16
12
channel 2 standby channel 1 + 2 on VP channel 1 on channel 2 on
8
4 channel 1 standby 0 0 2 4 6 8 10 12 14 16 VP (V) 18 20
Fig.15 VSELECT as a function of VP.
SE APPLICATION
handbook, full pagewidth
C1 1 F
R2 R1 10 k
100 k IN1- IN1+ C3 47 F OUT2- 17 16
20
11 OUT1-
C4 100 nF C6 470 F OUT1+ 18
VCC C5 100 F
Vi1
RL1
3 IN2- IN2+ SVRR MODE SELECT
C2 1 F
R4 R3 10 k
100 k 14 15 5 4 6
TDA8547TS
13 OUT2- C7 470 F OUT2+
Vi2
RL2
8 1 10
R2 Gain channel 1 = ------R1 R4 Gain channel 2 = ------R3 GND
MGK986
Fig.16 SE application.
1998 Apr 01
13
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, halfpage
10
MGD899
handbook, halfpage
10
MGD900
THD (%) 1
THD (%) 1
(1) (2)
10-1
(3)
10-1
(1) (2) (3)
10-2 10-2
10-1
1
Po (W)
10
10-2 10
102
103
104
f (Hz)
105
f = 1 kHz; Gv = 20 dB. (1) VCC = 7.5 V; RL = 4 . (2) VCC = 9 V; RL = 8 . (3) VCC = 12 V; RL = 16 .
Po = 0.5 W; Gv = 20 dB. (1) VCC = 7.5 V; RL = 4 . (2) VCC = 9 V; RL = 8 . (3) VCC = 12 V; RL = 16 .
Fig.17 THD as a function of Po.
Fig.18 THD as a function of frequency.
handbook, halfpage
-40
MGK993
cs (dB)
-60
(1) (2)
handbook, halfpage
-20
MGD902
SVRR (dB) -40
(1) (2)
-80
(3) (4)
-60
(3)
-100 10
102
103
104
f (Hz)
105
-80 10
102
103
104
f (Hz)
105
Vo = 1 V; Gv = 20 dB. (1) VCC = 7.5 V; RL = 4 . (2) VCC = 9 V; RL = 8 . (3) VCC = 12 V; RL = 16 . (4) VCC = 5 V; RL = 32 .
VCC = 7.5 V; RL = 4 ; RS = 0 ; Vr = 100 mV. (1) Gv = 24 dB. (2) Gv = 20 dB. (3) Gv = 0 dB.
Fig.19 Channel separation as a function of frequency.
Fig.20 SVRR as a function of frequency.
1998 Apr 01
14
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, halfpage
2
MGK994
Po (W) 1.6
handbook, halfpage
1.5
MGK995
P (W)
1.0 1.2
(1) (2) (3) (1) (2) (3)
0.8 0.5 0.4
0 0 4 8 12 VCC (V) 16
0 0 (1) RL = 4 . (2) RL = 8 . (3) RL = 16 . 4 8 12 VCC (V) 16
THD = 10%. (1) RL = 4 . (2) RL = 8 . (3) RL = 16 .
Fig.21 Po as a function of VCC.
Fig.22 Worst case power dissipation as a function of VCC (one channel active).
handbook, halfpage
1.2
MGK996
P (W) 0.8
(1)
(2) (3)
0.4
0 0 0.4 0.8 1.2 Po (W) 1.6
Sine wave of 1 kHz. (1) VCC = 12 V; RL = 16 . (2) VCC = 7.5 V; RL = 4 . (3) VCC = 9 V; RL = 8 .
Fig.23 Power dissipation as a function of Po (one channel active). 1998 Apr 01 15
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
TDA8547TS
handbook, full pagewidth
a. Top view copper layout.
+VCC
GND
-OUT1
100 F
+OUT1 10 k
TDA 8542TS 8547TS
100 nF IN1 1 F 20 11 k 11 k 47 F SELECT 1 56 k 10 k MODE
11 TDA 10 8542/47TS
IN2 1 F
56 k
CIC Nijmegen
+OUT2
MGK997
-OUT2
b. Top view components layout.
Fig.24 Printed-circuit board layout (BTL).
1998 Apr 01
16
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
TDA8547TS
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1998 Apr 01
17
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8547TS
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Apr 01
18
Philips Semiconductors
Product specification
2 x 0.7 W BTL audio amplifier with output channel switching
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8547TS
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Apr 01
19
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/00/02/pp20
Date of release: 1998 Apr 01
Document order number:
9397 750 03347

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